| 标题 |
Effect of Microstructure on the Electromigration Performance of 2- μm-Cu Redistribution Line under In-situ SEM Observation |
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| DOI | |
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期刊:2024 IEEE CPMT Symposium Japan (ICSJ) 作者:Min-Yan Tsai; Ting-Chun Lin; Yen-Cheng Huang; Shan-Bo Wang; Yung-Sheng Lin; et al 出版日期:2024-12-25 |
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(2025-6-4)