| 标题 |
Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging |
| 网址 | |
| DOI | |
| 其它 |
期刊:Polymers 作者:William Anderson Lee Sanchez; Jia‐Wun Li; Hsien‐Tang Chiu; Chih‐Chia Cheng; Kuo‐Chan Chiou; et al 出版日期:2022-07-21 |
| 求助人 | |
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(2025-6-4)