| 标题 |
Multi-port Dynamic Compact Thermal Models of BGA Package using Model Order Reduction and Metaheuristic Optimization |
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| 其它 |
期刊:2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 作者:Valentin Bissuel; Vincent Fox; Eric Monier-Vinard; Alain Neveu; Frederic Joly; Olivier Daniel 出版日期:2019-07-12 |
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(2025-6-4)