| 标题 |
Robust low-temperature soldering of Cu plates via a novel Ni@Cu10Ni alloy mesh reinforced SAC305 composite solder |
| 网址 | |
| DOI | |
| 其它 |
期刊:Soldering & Surface Mount Technology 作者:Anqi Yao; Huan Yu; Wenhao Ji; Ruxia Liu; Yong Xiao 出版日期:2026-05-01 |
| 求助人 | |
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(2025-6-4)