| 标题 |
Toward reducing no-clean flux spatter during reflow soldering: Investigating the effect of flux type, solder mask, and solder pad design |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Manufacturing Processes 作者:Petr Veselý; Karel Dušek; Denis Froš 出版日期:2022 |
| 求助人 | |
| 下载 | 该求助完结已超 24 小时,文件已从服务器自动删除,无法下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)