| 标题 |
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:Minghao Zhou; Li Li; Fengze Hou; He Guoqiang; Jiaqi Fan 出版日期:2022-05-30 |
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(2025-6-4)