| 标题 |
Modeling, design and demonstration of low-temperature, low-pressure and high-throughput thermocompression bonding of copper interconnections without solders |
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| DOI | |
| 其它 |
期刊:Electronic Components and Technology Conference 作者:N. Shahane; S. McCann; G. Ramos; Arnd Killian; Robin J. Taylor; et al 出版日期:2015-05-26 |
| 求助人 | |
| 下载 |
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(2025-6-4)