| 标题 |
Micro-scale fabrication and aging driven IMC evolution in SAC305/Sn-58Bi composite solder joints: A microstructural and mechanical correlation study |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:Dipayan Chakraborty; Nisar Ahamad Khan; Manish Kaushik; V Ravindra; Ajay Kumar 出版日期:2026-03-01 |
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(2025-6-4)