| 标题 |
 Comparative Analysis of Signal Integrity and Cost Efficiency in High Speed Serdes: Via-in-Pad vs. Non Via-in-Pad PCB Designs |
| 网址 | |
| DOI | |
| 其它 |
期刊：Impact 作者：Cooper Li; Chuck Lin; Passor Ho; Chloe Chen; Hellen Lo 出版日期：2024-10-22 |
| 求助人 | |
| 下载 | 暂无链接，等待应助者上传 |
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(2025-6-4)
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