| 标题 |
Void-Free, Low-Resistance Through-Glass Vias Formed Using a Reduction-Gas-Generating Sinterable Cu Paste |
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| DOI | |
| 其它 |
期刊:Electronic Components and Technology Conference 作者:M. Mariappan; K. Mori; Hiroyuki Hashimoto; Harumi Hosogoe; Hirokatsu Sakamoto; et al 出版日期:2026-05-26 |
| 求助人 | |
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(2025-6-4)