| 标题 |
Feasibility and Reliability Considerations of Liquid Metal Alloys in Advanced Packaging |
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| DOI | |
| 其它 |
期刊:2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) 作者:Wen-Yu Teng; Dai Fei Li; Jyun-De Jhan; Yung Ta Li; Andrew Kang; et al 出版日期:2026-04-14 |
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(2025-6-4)