| 标题 |
Fabrication of High-Conductive and Reliable Embedded Circuits in Glass Substrates via Pressure-Assisted Cu Nanoparticle Sintering |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:Guannan Yang; Dongchang Ma; Junyi Lu; Weiqiang Li; Chao Tang; et al 出版日期:2026-06-25 |
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(2025-6-4)