| 标题 |
Investigation Into Chemistry and Performance of No-Clean Flux in Fine Pitch Flip-Chip Package |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:Saif Wakeel; A. S. M. A. Haseeb; M. A. Amalina; Khoo Ly Hoon 出版日期:2021-09-04 |
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(2025-6-4)