| 标题 |
ABF-Based TSV Arrays With Improved Signal Integrity on 3-D IC/Interposers: Equivalent Models and Experiments |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者: Chuen-De Wang; Yu-Jen Chang; Yi-Chang Lu; Peng-Shu Chen; Wei-Chung Lo; et al 出版日期:2013 |
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(2025-6-4)