| 标题 |
Thermal protection by integration of vacuum insulation panel in liquid-cooled active thermal management for electronics package exposed to thermal radiation |
| 网址 | |
| DOI |
10.1115/1.4052740
doi
|
| 其它 |
期刊:Journal of Thermal Science and Engineering Apllications 作者:Midhun V. C.; S. Suresh 出版日期:2021-10-13 |
| 求助人 | |
| 下载 |
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(2025-6-4)