| 标题 |
A comprehensive review of diamond/copper composites for high thermal conductivity applications |
| 网址 | |
| DOI | |
| 其它 |
期刊:Heat and Mass Transfer 作者:Shuai Wang; Xiaoming Feng; Shihuan Zhang; Bin Li; Yonghai Zhang 出版日期:2026-02-21 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
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(2025-6-4)