| 标题 |
Influence of Design and Liner Material on Reliability of Through Glass Vias under Thermal Cycling: Numerical Modeling and Experimental Validation* |
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| DOI | |
| 其它 |
期刊:2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 作者:Dalei Yang; Junbo Yang; Karthik Arun Deo; Kewei Shou; Yuhan Gao; et al 出版日期:2026-05-26 |
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(2025-6-4)