| 标题 |
Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics and reliability 作者:V. Thukral; M. van Soestbergen; J. Zaal; R. Roucou; R. Rongen; et al 出版日期:2022-12-01 |
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(2025-6-4)