| 标题 |
Role of ethylenediamine additive in Cu growth on a Co/SiO2/Si substrate via electrochemical atomic layer deposition of Pb and its surface limited redox replacement |
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| DOI | |
| 其它 |
期刊:Applications of Surface Science 作者:Jai-Ling Wu; Jau-Shiung Fang 出版日期:2017-07-27 |
| 求助人 | |
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(2025-6-4)