| 标题 |
Challenges in interconnection and packaging of microelectromechanical systems (MEMS) |
| 网址 | |
| DOI | |
| 其它 |
期刊:2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) 作者:R. Ramesham; R. Ghaffarian 出版日期:暂无 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)