| 标题 |
Demonstration of a Hybrid Wiring Layer Assembly for Low-Cost sub-10μm Pitch Integration |
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| DOI | |
| 其它 |
期刊:2025 IEEE 75th Electronic Components and Technology Conference (ECTC) 作者:Vineeth Harish; Seungwoo Baek; Kai Zheng; Krutikesh Sahoo; Gilbert Park; et al 出版日期:2025-05-01 |
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(2025-6-4)