| 标题 |
Intermetallic compounds at aluminum-to-copper electrical interfaces: effect of temperature and electric current |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 作者:M. Braunovic; N. Alexandrov 出版日期:2002-08-25 |
| 求助人 | |
| 下载 | 该求助完结已超 24 小时,文件已从服务器自动删除,无法下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)