| 标题 |
Development of Thin Electroless Copper Plating Solution Using Glyoxylic Acid as Reducing Agent and its Practical Use |
| 网址 | |
| DOI |
10.4139/sfj.71.821
doi
|
| 其它 |
期刊:Journal of The Surface Finishing Society of Japan 作者:Katsumi MABUCHI; Haruo AKAHOSHI 出版日期:2020-12-01 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
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(2025-6-4)