| 标题 |
Nanocopper-based low-temperature interconnection technology: advances in material systems, sintering mechanisms and packaging applications |
| 网址 | |
| DOI | |
| 其它 |
期刊:Soldering & Surface Mount Technology 作者:Ye Tian; Haojie Chen; Lushan Ma; Chao Wang; Ziqiang Li; et al 出版日期:2026-06-01 |
| 求助人 | |
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(2025-6-4)