| 标题 |
Micro-3D-Printed Packaging Substrates With Embedded Through Holes for Organic Interposers |
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| DOI | |
| 其它 |
期刊:2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 作者:Nahyeon Kim; Haksoon Jung; Yongwoo Lee; Sungmin Eum; Yechan Han; et al 出版日期:2024-05-28 |
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(2025-6-4)