| 标题 |
High-strength, low-damage direct bonding of LiNbO3/glass wafers for the fabrication of glass-based SAW resonators |
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| 其它 |
期刊:2026 IEEE MTT-S International Conference on Microwave Acoustics & Mechanics (IC-MAM) 作者:Sho Nagai; Keisuke Nakao; Yasuo Hayashi 出版日期:2026-04-20 |
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(2025-6-4)