| 标题 |
Role of Silica-Epoxy Interface and Deep Traps on the Dielectric Breakdown Performance of Epoxy Moulding Compounds (EMC) |
| 网址 | |
| DOI | |
| 其它 |
期刊:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 作者:Lin Xiao Chua; Hui Qin Woo; Khai Seen Yong; Wu-Hu Li; Lay Poh Tan; Chee Lip Gan 出版日期:2022 |
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(2025-6-4)