| 标题 |
Next generation electronics packaging utilizing flip chip technology |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. 作者:G. Pascariu; Peter Cronin; D. Crowley 出版日期:2003-07-16 |
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(2025-6-4)