Numerical Simulation of Cu/Polymer-Dielectric Hybrid Bonding Process using Finite Element Analysis

In this work a numerical simulation model for chip to wafer hybrid bonding process with polymer dielectrics is developed using finite element analysis. Virtual design of experiments is conducted using the numerical model to evaluate the bonding area and peel stresses in the bonded interfaces for both Cu pad protrusion and dishing cases. The simulation results indicate that direct bonding of Cu/polymer interfaces can be achieved by using Cu pad protrusion and right combination of other design and process parameters. The simulations further show that the direct bonding window of design and process parameters is rather narrow for the Cu pad dishing case.