Schottky barrier heights and mechanism of charge transfer at metal-Bi2OS2 interfaces

欧姆接触 肖特基势垒 半导体 费米能级 材料科学 密度泛函理论 电极 凝聚态物理 化学物理 肖特基二极管 电子转移 单层 金属 化学 电子 光电子学 纳米技术 计算化学 物理 物理化学 图层(电子) 二极管 量子力学 冶金
作者
Xiaodong Zhang,Liping Feng,Shichen Zhong,Yuanming Ye,Haixi Pan,Pengfei Liu,Xiaoqi Zheng,Huanyong Li,Mingyang Qu,Xitong Wang
出处
期刊:Science China. Materials [Springer Science+Business Media]
卷期号:66 (2): 811-818 被引量:12
标识
DOI:10.1007/s40843-022-2183-8
摘要

Strong Fermi-level pinning (FLP) always occurs at the two-dimensional (2D) semiconductor-metal interface due to the complex interfacial charge transfer. By using monolayer (ML) Bi2OS2, an emerging 2D semiconductor with the highest electron mobility, the Schottky barrier heights (SBHs) and origin of charge transfer at Bi2OS2-metal interfaces are systematically studied based on density functional theory calculations. In 3D metal-Bi2OS2 interfaces, the formation of chemical bonding and the effect of Pauli exchange repulsion are found to be responsible for the strong interfacial charge transfer, resulting in strong FLP, and the direction of charge transfer induced by the two factors is opposite. Besides, an extra interfacial charge transfer is expected to equilibrate the Fermi level when the work functions (WFs) of metal electrodes are out of the range of electron affinity energy and ionization energy of semiconductors. For 2D metal-ML Bi2OS2 interfaces, surprisingly, the FLP is found to be entirely suppressed, and thereby, the 2D metal-Bi2OS2 contacts obey the conventional Schottky-Mott model. Such intriguing behavior arises from the 2D metal electrodes chosen in this work can effectively shield the effect of Pauli exchange repulsion. Consequently, wide-range and linear-tunable SBHs can be obtained and the conversion from n-type Ohmic contact to p-type Ohmic contact can be achieved by using 2D metal electrodes with different WFs. This study not only provides a theoretical foundation for selecting favorable metal electrodes in devices based on ML Bi2OS2, but also helps to enhance the understanding of the mechanism of interface interaction between metals and 2D semiconductors.
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