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Plastic flow and interfacial bonding behaviors of embedded linear friction welding process: Numerical simulation combined with thermo-physical experiment

材料科学 焊接 可塑性 物流 机械 摩擦焊接 计算机模拟 复合材料 结构工程 工程类 生态学 物理 生物
作者
Tiejun Ma,Zhenguo Guo,Xiawei Yang,Junlong JIN,Xi Chen,Jun Tao,Wenya Li,Achilles Vairis,Liukuan YU
出处
期刊:Chinese Journal of Aeronautics [Elsevier BV]
卷期号:38 (1): 102899-102899 被引量:4
标识
DOI:10.1016/j.cja.2023.12.034
摘要

In this study, a new linear friction welding (LFW) process, embedded LFW process, was put forward, which was mainly applied to combination manufacturing of long or overlong load-carrying titanium alloy structural components in aircraft. The interfacial plastic flow behavior and bonding mechanism of this process were investigated by a developed coupling Eulerian-Lagrangian numerical model using software ABAQUS and a novel thermo-physical simulation method with designed embedded hot compression specimen. In addition, the formation mechanism and control method of welding defects caused by uneven plastic flow were discussed. The results reveal that the plastic flow along oscillating direction of this process is even and sufficient. In the direction perpendicular to oscillation, thermo-plastic metals mainly flow downward along welding interface under coupling of shear stress and interfacial pressure, resulting in the interfacial plastic zone shown as an inverted "V" shape. The upward plastic flow in this direction is relatively weak, and only a small amount of flash is extruded from top of joint. Moreover, the wedge block and welding components at top of joint are always in un-steady friction stage, leading to non-uniform temperature field distribution and un-welded defects. According to the results of numerical simulation, high oscillating frequency combined with low pressure and small amplitude is considered as appropriate parameter selection scheme to improve the upward interfacial plastic flow at top of joint and suppress the un-welded defects. The results of thermo-physical simulation illustrate that continuous dynamic recrystallization (CDRX) induces the bonding of interface, accompanying by intense dislocation movement and creation of many low-angle grain boundaries. In the interfacial bonding area, grain orientation is random with relatively low texture density (5.0 mud) owing to CDRX.

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