Influence of Stiffener Design on Co-Packaged Optics (CPO) 2.5D Heterogeneous Packages

The growth in 5G, AI, HPC and IoT have been in the rise in the past few years. This exponential growth has led to research and development of co-packaged optics (CPO) packages which incorporate photonic devices with the conventional electronics because the conventional pluggable solutions were unable to catch up with the requirements. This has led to a dramatic reduction in interconnect length, power consumption and hence an increase in the overall energy efficiency. To reduce the warpage of the overall component, stiffener rings are used on electronic components. The CPO solutions require optical connectors to be mounted onto the substrate which requires modifications to the current stiffener layout designs. These modifications led to an increase in the warpage in turn reducing the thermal fatigue life performance. Since the CPO technology has been proven to be the way forward, significant effort has to be put into realizing the influence of the modifications done. This study deals with investigating the modifications made and their influence on the warpage and maximum stress developed on the interposer.