P‐5.7: Examining Pressure‐sensitive Damping Silicone Adhesive with Excellent Cushioning Capabilities for AMOLED Display

With the market for organic light‐emitting diodes expanding, the devices' cushioning capabilities and lightweight design are attracting more attention and causing issues. In this study, a unique type of pressure‐sensitive silicone adhesive is proposed. Meanwhile, a damping silicone pressure‐sensitive adhesive is added to the light‐emitting diode module, increasing its drop height from 40 to 55 mm and satisfying the controlled demand for the cushioning quality.