多路复用器
互连
GSM演进的增强数据速率
超材料
计算机科学
反向
多路复用
电子工程
光电子学
材料科学
电信
工程类
数学
几何学
作者
Aolong Sun,Sizhe Xing,Xuyu Deng,Ruoyu Shen,An Yan,Fangchen Hu,Yuqin Yuan,Boyu Dong,Junhao Zhao,Ouhan Huang,Ziwei Li,Jianyang Shi,Yingjun Zhou,Chao Shen,Yiheng Zhao,Bingzhou Hong,Wei Chu,Junwen Zhang,Haiwen Cai,Nan Chi
标识
DOI:10.1038/s41467-025-57689-7
摘要
The escalating demands of compute-intensive applications urgently necessitate the adoption of optical interconnect technologies to overcome bottlenecks in scaling computing systems. This requires fully exploiting the inherent parallelism of light across scalable dimensions for data loading. Here we experimentally demonstrate a synergy of wavelength- and mode- multiplexing combined with high-order modulation formats to achieve multi-tens-of-terabits-per-second optical interconnects using foundry-compatible silicon photonic circuits. Implementing an edge-guided analog-and-digital optimization method that integrates high efficiency with fabrication robustness, we achieve the inverse design of mode multiplexers based on digital metamaterial waveguides. Furthermore, we employ a packaged five-mode multiplexing chip, achieving a single-wavelength interconnect capacity of 1.62 Tbit s−1 and a record-setting multi-dimensional interconnect capacity of 38.2 Tbit s−1 across 5 modes and 88 wavelength channels, with high-order formats up to 8-ary pulse-amplitude-modulation (PAM). This study highlights the transformative potential of optical interconnect technologies to surmount the constraints of electronic links, thus setting the stage for next-generation datacenter and optical compute interconnects. This study demonstrates a 38.2 Tbit/s optical interconnect using silicon photonic circuits, combining wavelength- and mode-multiplexing with high-order modulation for ultra-high-capacity data transmission and scaling next-gen computing systems.
科研通智能强力驱动
Strongly Powered by AbleSci AI