Tutorial: Fundamentals of Circuit Design for 2.5D/3D Integration

Chiplets and 2.5D/3D integration schemes allow performance and yield beyond monolithic approaches. This tutorial covers advanced packaging technologies and the new capabilities they enable. Circuit techniques suitable for side-by-side and stacked integration will be reviewed, including mitigation of inter-symbol-interferences, timing alignment between data and forwarded clocks, shielding against crosstalk, and integrity of power-delivery networks. An example system achieving throughput of 11Tb/s along one millimeter die edge is demonstrated.