Study on Urea-Modified Phenol Formaldehyde Resin Adhesive

In order to improve the curing rate of phenol formaldehyde resin adhesive, the authors of this paper used urea to co-condense with phenol and formaldehyde to make tri-cocondensated resin adhesive. DSC analysis showed that the initial exothermic peak temperture of PUF resin was lower than that of PF resin. The curing temperture of PUF was 25℃ lower than that of PF. Both the properties of particleboard bonded with PF and PUF resin were measured up to the German standard DIN 68763 V100. When using urea to substitute 25%-30% of total phenol, the hot-pressing time could be reduced by 35%,and the cost of PUF would be reduced by 15% -20% compared with common PF resin.