Study on new technology of electroplating of copper from HEDP

In this paper,a new process of direct electroplating of copper from HEDP was developed to replace the toxic cyanide copper plating bath.The effects of master plating component and various plating parameters were analyzed,while the properties of the plating bath and the coating quality were compared with cyanide copper plating bath as well.The result show that the HEDP-Cu plating bath has same separate and covering power as cyanide copper plating bath,the current efficiency is much batter(is up to 90%),while the properties of plating bath such as bonding on matrix are favorable and no brittleness basically,which indicates that it could be feasible to replace the toxic cyanide plating bath.