Measurement of Cyclis Stresses Caused in High Temperature Range by Nickel Electroplating : 4th Report, An Application of Copper Sulfate Bath for the Basal Plating

In the nickel electroplating method of stress analysis, basal copper plating is indispensable when nickel is deposited directly on a steel specimen. in this paper, when the acid copper plating executed in a sulfate bath is utilized as the basal plating, effects of the current density and the thickness of the basal copper plating on the proper stress of the upper nickel plating are examined, and an optimum condition form the basal plating is obtained. From the results obtained, it is concluded that the acid copper plating executed in the sulfate bath can be used satisfactorily as the basal one in the nickel electroplating method.