Cathodic Debond of Anodically Bonded Silicon to Glass Wafers

The bond quality of anodically bonded wafers was studied after reversing the current through the bonded interface. After a cathodic process the bond quality decreased with increasing reverse current. The degradation of the bond depended on the glass quality and on the original bond. Pyrex no. 7740 and Hoya SD-2 glass wafers were tested. ©2000 The Electrochemical Society