材料科学
等离子体
碎片
喷射(流体)
激光烧蚀
钻探
大气压等离子体
氩
激光器
复合材料
撞击坑
烧蚀
腐蚀
激光诱导击穿光谱
粒子(生态学)
辉光放电
作者
Eung Suok Lee,Hae Il Park,Hong Koo Baik,Se Jong Lee,Kie Moon Song,Myung Keun Hwang,Chang Su Huh
标识
DOI:10.1016/s0257-8972(03)00291-3
摘要
We devised a multi-jet atmospheric glow plasma system and successfully verified a possibility to ignite and maintain an atmospheric pressure discharge using helium, argon or a mixture of helium and oxygen gas. In this study, as an alternative method to the conventional wet cleaning process, the multi-jet atmospheric glow plasma system was applied to clean the ablation debris inside the blind via holes from micro-via drilling process of printed circuit boards (PCBs) prior to electroplating process. Scanning electron microscope images, after the multi-jet atmospheric glow plasma treatment of the PCBs, showed effective removal of residual organic impurities and massive fibrous debris when compared with low-pressure vacuum plasma treatment. Consequently, we demonstrated that multi-jet atmospheric glow plasma system could not only effectively remove organic impurities and massive fibrous debris generated during micro-via drilling process, but also enhance the electroplating process and the wire bondability.
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