Defeating counterfeiters with microscopic dielets embedded in electronic components

Supply-chain traceability and electronics counterfeiting have become increasingly widespread issues for military and commercial electronics systems. In response to a DARPA SHIELD program directive, Northrop Grumman is leading a team to develop tiny, passive, near-field RFID chips, called dielets, which will be embedded in electronic component packaging. The design and implementation of dielets minimizes costs for electronics manufacturers while maximizing the security of the electronics supply chain.