Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits

The purpose of this paper is to present a newly developed process for the fabrication of multilayer circuits based on the pad-printing technique. Even though the maturity level, in terms of accuracy, substrate type and print size of several printing industrial processes is relatively high, the fabrication complexity of multilayer printed electronics remains relatively high. Due to its versatility, the pad-printing technique allows the superposition of printed conductive and insulating layers. Compared to other printing processes, its main advantage is the ability to print on various substrates even on flexible, curved or irregular surfaces. Silver-based inks were used for the formulation of conductive layers while UV inks were employed to fulfil the functionality of the insulating layers. To demonstrate the functionality of the pad-printing results, a multilayer test pattern has been designed and printed on Kapton®. Furthermore, to demonstrate the efficacy of this approach, a multilayer circuit composed of three stacked layers has been designed and printed on various substrates including Kapton®, paper and wood. This electronic circuit controls an array of LEDs through the manipulation of a two-key capacitive touch sensor. This study, allowed us to define recommendations for the different parameters leading to high printing quality. We expect a long-term beneficial impact of this study towards a low-cost, fast, and environmental-friendly production of printed electronics.