High-Performance Packaging of RF/mm-wave Chiplets with 3-D Stitch-Chips (3DSCs)

This letter presents the design, fabrication, and characterization of a 3-D stitch-chip (3DSC) interconnection technology, developed for heterogeneous integration of radio frequency (RF) and mm-wave components in a 3-D module. In this work, a low-noise amplifier (LNA) was interconnected to assess the 3DSC performance in the 24-40 GHz range and was benchmarked against a baseline wire-bonded module. The 3DSC design flow is outlined and key fabrication steps are summarized. The 3DSC preserves die performance by providing a low-loss and low-reflection interconnection, demonstrating the effectiveness of 3DSC technology for advanced RF/mm-wave system integration.