材料科学
复合材料
环氧树脂
极限抗拉强度
氮化硼
杨氏模量
空隙(复合材料)
涂层
动态力学分析
模数
扫描电子显微镜
纳米复合材料
复合数
旋涂
薄膜
聚合物
纳米技术
作者
Richard Voo,M. Mariatti,L. C. Sim
标识
DOI:10.1177/8756087911419745
摘要
Tensile and dynamic mechanical properties of thin film epoxy composites containing different types of fillers such as synthetic diamond (SD), silicon nitride, and boron nitride (BN) were investigated. The filler contents were varied between 0 and 2 vol.%. Spin coating technique was employed to produce thin film with thickness of 40–60 µm. Tensile test results show that addition of SD obviously improves the strength and Young's modulus, and increases the storage modulus ( E′) of the epoxy thin film composite. The addition of 2 vol.% SD increases the Young's modulus and tensile strength by almost two times the properties of neat epoxy. Scanning electron microscopy showed void formation and poor interfacial analysis which explains the reduced tensile strength of BN filler epoxy composites.
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