A Novel Concept Methodology of In-direct Cold Plate Liquid Cooling Design for Data Center in CPU Socket Area

With the development of 5G, AI, IoT and smart city technologies, data center is the core cornerstone of Computing, Storage and Interconnection. With the computing capability increasing, the CPU power dissipation is dramatically increased in recent years. The Intel Xeon CPU is targeting up to 300W or even higher power level in the Intel latest silicon road map, which brings big thermal challenge to design feasible thermal solutions for both system and data center. The in-direct cold plate liquid cooling solution is proposed with high cooling efficiency, better PUE and improved noise control in data center. This paper discusses the different cold plate design including the flow channel design, flow impedance and thermal resistance comparison. A new liquid cooling for CPU cold plate product concept and performance assessment methodology as well as engineering practice from JD.com system design is also proposed.