Corrosion Behavior of Copper in Chloride Media

The electrochemical behavior of copper in 0.05 M HCl and 0.05 M NaCl carried out at open-circuit potential and at constant anodic potential after one hour has been investigated using electrochemical impedance spectroscopy (EIS) at 20 °C, 40 °C and 60 °C. The formation of copper chloride (CuCl) film does not protect copper from dissolution in the chloride media. The physical properties of the passive film such as, polarization resistance (Rp), capacitance (C), loss fac- tor (%P), Warburg diffusion coefficient (W) and Kugel diffusion constant (k) were obtained from EIS measurements. Also, the radii of the pores formed as a result of anodic polarization have been calculated.