Process optimization for the sputter deposition of molybdenum thin films as electrode for AlN thin films

Molybdenum thin films have been deposited on Ti/(100) Si substrates by dc sputtering. For process optimization, a design of experiments method was used with three input factors (target power, substrate temperature, and process gas flow). Deposition rate, resistivity, roughness, diffraction angle, and rocking curve width were analyzed as output responses using statistical analysis method. Subsequently, a process allowing the deposition of highly crystalline, smooth, and low resistivity Mo film was selected and tested against film thickness. The as-optimized sputtered molybdenum thin film was used as seeding electrode for the growth of highly c-axis textured AlN film by dc pulsed reactive sputtering.