Low temperature relaxation of DGEBA epoxy resins: A thermally stimulated discharge current (TSDC) study

Abstract The effect of curing conditions on the low temperature relaxation behavior of catalyst‐cured epoxy systems based on digliycidyl ether of bisphenol A (DGEBA) has been characterized by the thermally stimulated discharge current (TSDC) technique. In these chemically relatively simple epoxy systems, five relaxation processes, designated as γ, β, β′, β OH , and β″, have been observed: Their molecular origins are discussed in detail. The results are in agreement with prior suggestions of an inhomogeneous cross‐link density morphology.