3D Stacking Heterogeneous Integration for Devices and Modules

This paper presents a 3D heterogeneous approach to integrate a FBAR device and some 3D modules, which provide both addition-al interconnects, RF functions and packaging functionality. The feasibility of this approach has been proven by the successful reali-zation of 3D demonstration vehicles. The RF behavior of the de-monstrators has been assessed and good performances have been obtained.