High-density analysis of surface wave profile imaging based on a multiple coverage common-midpoint signal-couple array

Surface wave exploration technology has been extensively used in the inspection of construction engineering quality and shallow surface surveys. To enhance the efficiency of surface wave exploration field acquisition and achieve high-precision and high-density surface wave profile imaging, a wireless distributed seismic surface wave signal acquisition system has been developed based on the principles of active source transient surface wave signal acquisition and dispersion curve calculation methods. For the purpose of achieving rapid multiple coverage signal acquisition and enhancing fieldwork efficiency, a method for rapidly configuring common-midpoint signal couples (CMCs) for multiple coverage common-shot signal acquisition has been devised, and a high-precision visualization method for dispersion curve calculation based on the CMC array has been formulated. When compared with the multichannel analysis of the surface wave method under identical conditions, the CMC array can effectively enhance surface wave dispersion curve survey station density and lateral resolution, thereby enabling high-density analysis of surface wave profile imaging. Through model analysis and field examples related to construction quality detection, including foundation compactness and earth and rock mixture compactness, it has been demonstrated that this method offers significant advantages in terms of high accuracy, high density, and a wide application range. These advantages greatly enhance the efficiency of surface wave exploration and the accuracy of profile imaging for the construction of engineering projects.